Winbond ISD2540S

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

28

Number of Terminals

28

RoHS

Compliant

Package Description

SOP, SOP28,.4

Package Style

SMALL OUTLINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SOP28,.4

Manufacturer Part Number

ISD2540S

Package Code

SOP

Package Shape

RECTANGULAR

Manufacturer

Nuvoton Technology Corp

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NUVOTON TECHNOLOGY CORP

Risk Rank

5.8

Part Package Code

SOIC

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Subcategory

Audio Synthesizer ICs

Technology

CMOS

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Terminal Pitch

The center distance from one pole to the next.

1.27 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

28

JESD-30 Code

R-PDSO-G28

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

5 V

Supply Current-Max

30 mA

Consumer IC Type

SPEECH SYNTHESIZER WITH RCDG

Reading Time-Max

40 s

Lead Free

Contains Lead