Winbond W681310R

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Material

Cast Iron

Number of Terminals

20

Manufacturer Part Number

GR-B813-7.5-R

Manufacturer

Grove Gear

Package Description

SSOP, SSOP20,.3

Package Style

SMALL OUTLINE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SSOP20,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

No

Package Code

SSOP

Package Shape

RECTANGULAR

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NUVOTON TECHNOLOGY CORP

Risk Rank

5.71

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Subcategory

Codecs

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.635 mm

Reach Compliance Code

compliant

JESD-30 Code

R-PDSO-G20

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

3/5 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Number of Channels

1

Number of Bits

8

Supply Current-Max

5 mA

Input Type

Solid Shaft

Telecom IC Type

PCM CODEC

Filter

YES

Companding Law

A/MU-LAW

Gain Tolerance-Max

1.6 dB

Lead Free

Contains Lead