Xilinx Inc. XC7Z100-2FFG900I

Factory Lead Time

10 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Copper, Silver, Tin

Mount

Surface Mount

Package / Case

900-BBGA, FCBGA

Number of Pins

900

Number of I/Os

212

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~100°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

Zynq®-7000

Published

2010

JESD-609 Code

e1

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Number of Terminations

900

ECCN Code

3A991.D

Terminal Finish

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.39.00.01

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

245

Supply Voltage

1V

Terminal Pitch

The center distance from one pole to the next.

1mm

Frequency

800MHz

Time@Peak Reflow Temperature-Max (s)

30

Base Part Number

XC7Z100

Supply Voltage-Max (Vsup)

1.05V

Supply Voltage-Min (Vsup)

0.95V

Interface

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

RAM Size

256KB

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Peripherals

DMA

Connectivity

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture

MCU, FPGA

Data Bus Width

32b

Core Architecture

ARM

Boundary Scan

YES

RAM (words)

256000

Primary Attributes

Kintex™-7 FPGA, 444K Logic Cells

Bus Compatibility

CAN; ETHERNET; I2C; SPI; UART; USB

Length

31mm

Height Seated (Max)

3.35mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant