Xilinx Inc. XCMECH-FG900

Factory Lead Time

18 Weeks

Mounting Type

Surface Mount

Package / Case

900-BBGA

Supplier Device Package

900-FBGA (31x31)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Published

2012

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Type

Mechanical Sample

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant