XCV1000-4BG560C

Xilinx Inc. XCV1000-4BG560C

Part No:

XCV1000-4BG560C

Manufacturer:

Xilinx Inc.

Datasheet:

Virtex 2.5 V

Package:

560-LBGA Exposed Pad, Metal

AINNX NO:

7563268-XCV1000-4BG560C

Description:

IC FPGA 404 I/O 560MBGA

Products specifications
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    560-LBGA Exposed Pad, Metal
  • Number of I/Os
    404
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~85°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    Virtex®
  • Published
    2000
  • JESD-609 Code
    e0
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    560
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Voltage - Supply
    2.375V~2.625V
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Supply Voltage
    2.5V
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27mm
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    XCV1000
  • Pin Count

    a count of all of the component leads (or pins)

    560
  • JESD-30 Code
    S-PBGA-B560
  • Number of Outputs
    404
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    2.5V
  • RAM Size
    16kB
  • Clock Frequency
    250MHz
  • Number of Inputs
    404
  • Programmable Logic Type

    Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    27648
  • Total RAM Bits
    131072
  • Number of Gates

    The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

    1124022
  • Number of LABs/CLBs
    6144
  • Speed Grade
    4
  • Combinatorial Delay of a CLB-Max
    0.8 ns
  • Height Seated (Max)
    1.7mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
  • Lead Free
    Contains Lead
0 Similar Products Remaining
Documents & Media Download datasheets and manufacturer documentation for Xilinx Inc. XCV1000-4BG560C.