ALTERA 10AS027H3F34I2LG

Package / Case

0805 (2012 Metric)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

0805

Number of Terminals

1152

Package

Tape & Reel (TR)

Base Product Number

RS73G2ART

Mfr

KOA Speer Electronics, Inc.

Product Status

Active

Number of I/Os

384

Moisture Sensitive

Yes

Shipping Restrictions

This product may require additional documentation to export from the United States.

L1 Cache Instruction Memory

2 x 32 kB

Maximum Clock Frequency

1.2 GHz

Number of Logic Elements

270000 LE

Factory Pack QuantityFactory Pack Quantity

1

Mounting Styles

SMD/SMT

Number of Logic Array Blocks - LABs

33750 LAB

Part # Aliases

964820

Manufacturer

Intel

Brand

Intel / Altera

Tradename

Arria 10 SoC

RoHS

Details

L1 Cache Data Memory

2 x 32 kB

Data RAM Size

-

Package Description

BGA, BGA1152,34X34,40

Package Style

GRID ARRAY

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA1152,34X34,40

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

0.9 V

Reflow Temperature-Max (s)

NOT SPECIFIED

Supply Voltage-Min

0.87 V

Operating Temperature-Max

100 °C

Rohs Code

Yes

Manufacturer Part Number

10AS027H3F34I2LG

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

Active

Ihs Manufacturer

INTEL CORP

Supply Voltage-Max

0.93 V

Risk Rank

5.43

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C ~ 155°C

Series

RS73-RT

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Size / Dimension

0.079 L x 0.049 W (2.00mm x 1.25mm)

Tolerance

±0.5%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Number of Terminations

2

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

±50ppm/°C

Resistance

464 kOhms

Composition

Thick Film

Power (Watts)

0.25W, 1/4W

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.39.00.01

Subcategory

SOC - Systems on a Chip

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

compliant

JESD-30 Code

S-PBGA-B1152

Number of Outputs

384

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

-

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

0.9 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Speed

1.5GHz

RAM Size

256KB

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Peripherals

DMA, POR, WDT

Program Memory Size

-

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture

MCU, FPGA

Number of Inputs

384

Seated Height-Max

3.65 mm

Programmable Logic Type

Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

FIELD PROGRAMMABLE GATE ARRAY

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

SoC FPGA

Primary Attributes

FPGA - 270K Logic Elements

Number of Logic Cells

An FPGA contains a large number of logic cells. Each logic cell can be configured to implement a certain set of functions. Each logic cell has a fixed number of inputs and outputs. Flip-flop can be incorporated into a multiplexer-based logic module to implement sequential logic.

270000

Number of Cores

2 Core

Flash Size

--

Features

Automotive AEC-Q200

Product Category

a particular group of related products.

SoC FPGA

Height Seated (Max)

0.023 (0.60mm)

Width

35 mm

Length

35 mm

Ratings

AEC-Q200