S71JL064H80BAW010

AMD S71JL064H80BAW010

Part No:

S71JL064H80BAW010

Manufacturer:

AMD

Datasheet:

Package:

-

AINNX NO:

69157845-S71JL064H80BAW010

Category:

Specialized

Description:

Memory Circuit, Flash+SRAM, 4MX16, CMOS, PBGA73, 11.60 X 8 MM, FBGA-73

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    73
  • Rohs Code
    Yes
  • Part Life Cycle Code
    Transferred
  • Ihs Manufacturer
    ADVANCED MICRO DEVICES INC
  • Part Package Code
    BGA
  • Package Description
    LFBGA, BGA73,10X12,32
  • Access Time-Max
    70 ns
  • Number of Words
    4194304 words
  • Number of Words Code
    4000000
  • Operating Temperature-Max
    85 °C
  • Operating Temperature-Min
    -25 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    LFBGA
  • Package Equivalence Code
    BGA73,10X12,32
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH
  • Supply Voltage-Nom (Vsup)
    3 V
  • ECCN Code
    EAR99
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    SRAM IS ORGANIZED AS 512K X 16 / 1M X 8; FLASH CAN ALSO BE ORGANIZED AS 8M X 8
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.71
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8 mm
  • Reach Compliance Code
    compliant
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Pin Count

    a count of all of the component leads (or pins)

    73
  • JESD-30 Code
    R-PBGA-B73
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.3 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    OTHER
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ASYNCHRONOUS
  • Supply Current-Max
    0.045 mA
  • Organization
    4MX16
  • Seated Height-Max
    1.4 mm
  • Memory Width
    16
  • Memory Density
    67108864 bit
  • Memory IC Type
    MEMORY CIRCUIT
  • Mixed Memory Type
    FLASH+SRAM
  • Length
    11.6 mm
  • Width
    8 mm
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