55623-050LF

Amphenol Information Communication & Commercial 55623-050LF

Part No:

55623-050LF

Datasheet:

-

Package:

-

AINNX NO:

31935938-55623-050LF

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Automotive
    No
  • PPAP
    No
  • Terminal Pitch (mm)
    1.27
  • Termination Method
    Solder
  • Body Orientation
    Right Angle
  • Maximum Current Rating (A)
    0.5/Contact
  • Maximum Voltage Rating
    5VDC
  • Maximum Insertion Force
    39.2N
  • Product Depth (mm)
    92.55
  • Mounting
    Surface Mount
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Type
    PCMCIA
  • Number of Rows
    4
  • Gender
    HDR
  • Number of Contacts
    136
  • Terminal Plating
    Tin Over Nickel
  • Product Length (mm)
    63
  • Product Height (mm)
    15.16
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