Ampleon USA Inc. BLP25RFE001E

Factory Lead Time

13 Weeks

Mounting Type

Surface Mount

Package / Case

28-VFQFN Exposed Pad

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Frequency

433MHz~434.8MHz 902MHz~928MHz 2.4GHz~2.4835GHz

Function

Divide-by-2

RF Type

The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

ISM

Secondary Attributes

SPI Interface