Ampleon USA Inc. BLP25RFE001Y

Factory Lead Time

13 Weeks

Mounting Type

Surface Mount

Package / Case

28-VFQFN Exposed Pad

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Frequency

433MHz~434.8MHz 902MHz~928MHz 2.4GHz~2.4835GHz

Function

Divide-by-2

RF Type

The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

ISM

Secondary Attributes

SPI Interface