Aries Electronics 01-0625-70

Factory Lead Time

5 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Contact Materials

PHOSPHOR BRONZE

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

0625

Published

2006

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

Connector Type

Header Strip

Number of Positions

1

Color

Black

Number of Rows

1

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

STACKABLE

MIL Conformance

NO

DIN Conformance

NO

IEC Conformance

NO

Filter Feature

NO

Contact Type

Post

Mixed Contacts

NO

Option

GENERAL PURPOSE

Pitch

2.54mm

Total Number of Contacts

1

Contact Finish

Tin

Lead Pitch

2.54mm

Contact Gender

MALE

UL Flammability Code

94V-0

Contact Finish Thickness

200.0μin 5.08μm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant