CEL (California Eastern Laboratories) PS9113-V-F3-AX

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Number of Channels per Chip

1

Maximum Data Rate

1Mbps

Direction Type

Uni-Directional

Minimum Isolation Voltage (Vrms)

3750

Maximum Propagation Delay Time (ns)

750

Maximum Forward Current (mA)

25

Maximum Continuous Output Current (mA)

15

Current Transfer Ratio Test Current (mA)

10

Minimum Current Transfer Ratio (%)

44

Maximum Current Transfer Ratio (%)

110(Typ)

Minimum Forward Voltage (V)

1.3

Typical Forward Voltage (V)

1.65

Maximum Forward Voltage (V)

2.1

Maximum Reverse Voltage (V)

5

Maximum Power Dissipation (mW)

100

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

100

Mounting

Surface Mount

Package Height

2.5

Package Width

4.4

Package Length

3.4

PCB changed

5

Standard Package Name

SOP

Supplier Package

SOP

Lead Shape

Gull-wing

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Unconfirmed

Pin Count

a count of all of the component leads (or pins)

5

Output Type

Open Collector

Polarity

Inverting

Input Type

DC

Standard

DIN|EN|UL|VDE