Comchip Technology CDBFR0240

Factory Lead Time

10 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

1005 (2512 Metric)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2011

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

ECCN Code

EAR99

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

150mW

Case Code (Metric)

2512

Case Code (Imperial)

1005

Speed

Small Signal =< 200mA (Io), Any Speed

Diode Type

Schottky

Current - Reverse Leakage @ Vr

10μA @ 30V

Voltage - Forward (Vf) (Max) @ If

550mV @ 200mA

Forward Current

Current which flows upon application of forward voltage.

200mA

Operating Temperature - Junction

125°C Max

Forward Voltage

the amount of voltage needed to get current to flow across a diode.

450mV

Max Reverse Voltage (DC)

40V

Average Rectified Current

Mainly used to characterize alternating voltage and current. It can be computed by averaging the absolute value of a waveform over one full period of the waveform.

200mA

Peak Reverse Current

The maximum voltage that a diode can withstand in the reverse direction without breaking down or avalanching.If this voltage is exceeded the diode may be destroyed. Diodes must have a peak inverse voltage rating that is higher than the maximum voltage that will be applied to them in a given application.

1μA

Max Repetitive Reverse Voltage (Vrrm)

40V

Capacitance @ Vr, F

9pF @ 10V 1MHz

Max Forward Surge Current (Ifsm)

2A

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant