DA14682-00F08A92

Dialog Semiconductor GmbH DA14682-00F08A92

Part No:

DA14682-00F08A92

Package:

60-WFQFN Exposed Pad

ROHS:

AINNX NO:

1688170-DA14682-00F08A92

Description:

QFN-60 / Bluetooth Low Energy 5.0 SoC with Flexpower ARM Cortex M0

Products specifications
  • Factory Lead Time
    12 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    60-WFQFN Exposed Pad
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Telecom IC Type
    TELECOM CIRCUIT
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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