Diodes Incorporated DMC2400UV-7

Factory Lead Time

16 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

SOT-563, SOT-666

Number of Pins

6

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

1.03A 700mA

Number of Elements

1

Turn Off Delay Time

It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

13.74 ns

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C~150°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2011

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

6

ECCN Code

EAR99

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HIGH RELIABILITY

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

450mW

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Base Part Number

DMC2400

Pin Count

a count of all of the component leads (or pins)

6

Number of Channels

2

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

450mW

Turn On Delay Time

Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

4.06 ns

FET Type

N and P-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

480m Ω @ 200mA, 5V

Vgs(th) (Max) @ Id

900mV @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

37.1pF @ 10V

Gate Charge (Qg) (Max) @ Vgs

0.5nC @ 4.5V

Polarity/Channel Type

N-CHANNEL AND P-CHANNEL

Continuous Drain Current (ID)

1.03A

Drain to Source Breakdown Voltage

20V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Max Junction Temperature (Tj)

150°C

FET Feature

Logic Level Gate

Height

600μm

Length

1.7mm

Width

1.25mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free