EPCOS (TDK) C0603X5R1C222MT

Package / Case

0201

Number of Terminals

2

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Capacitance Value

0.0022uF

Microwave Application

No

Mounting

Surface Mount

Case Style

Ceramic Chip

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

85

Product Depth (mm)

0.3

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Tolerance

20%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Construction

Flat

Termination Style

Pad

Dielectric

X5R

Voltage

16VDC

Size(mm)

0.6 X 0.3 X 0.3

Product Length (mm)

0.6

Product Height (mm)

0.3