EPCOS (TDK) C1608C0G1H1R5BT

Package / Case

0603

Number of Terminals

2

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Capacitance Value

1.5pF

Microwave Application

No

Mounting

Surface Mount

Case Style

Ceramic Chip

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Product Depth (mm)

0.8

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Tolerance

0.1pF

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Construction

Flat

Termination Style

Pad

Dielectric

C0G

Voltage

50VDC

Size(mm)

1.6 X 0.8 X 0.8

Product Length (mm)

1.6

Product Height (mm)

0.8