EPCOS (TDK) C1608X7R1E154KT000N

Package / Case

0603

Number of Terminals

2

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Capacitance Value

0.15uF

Equivalent Series Resistance Type

Low

Microwave Application

Yes

Special Features

Low ESL

Mounting

Surface Mount

Case Style

Ceramic Chip

Dissipation Factor (%)

3

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Product Depth (mm)

0.8

Length Tolerance (mm)

±0.1

Depth Tolerance (mm)

±0.1

Height Tolerance (mm)

±0.1

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Tolerance

10%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

NRND

Construction

Flat

Termination Style

Pad

Dielectric

X7R

Voltage

25VDC

Size(mm)

1.6 X 0.8 X 0.8

Product Length (mm)

1.6

Product Height (mm)

0.8