Fastron EK-1210FTC-STD

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

Ferrite

Minimum Quality Factor

Varies by Part

Maximum DC Resistance

Varies by Part

Maximum Self Resonant Frequency

Varies by Part

Package

1210

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Engineer Kit

Tolerance

10%

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

Varies by Part

Inductance

1.0mH to 1.29mH