Fastron EK-4408AQ-J

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

Ceramic & Ferrite

Minimum Quality Factor

Varies by Part

Maximum DC Resistance

Varies by Part

Maximum Self Resonant Frequency

Varies by Part

Package

4408

Agency Approvals

AEC-Q200-standard

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Engineer Kit

Tolerance

5%

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

Varies by Part

Inductance

4.7mH to 13.50mH