Freescale Semiconductor, Inc. (NXP Semiconductors) GS8160Z36BGT-150I

EU RoHS

Compliant

ECCN (US)

3A991.b.2.b

HTS

8542.32.00.41

Chip Density (bit)

18M

Number of Words

512K

Number of Bits/Word (bit)

36

Data Rate Architecture

SDR

Address Bus Width (bit)

19

Timing Type

Synchronous

Max. Access Time (ns)

7.5@Flow-Through|3.8@Pipelined

Maximum Clock Rate (MHz)

133@Flow-Through|150@Pipelined

Process Technology

CMOS

Minimum Operating Supply Voltage (V)

2.3|3

Typical Operating Supply Voltage (V)

2.5|3.3

Maximum Operating Supply Voltage (V)

2.7|3.6

Operating Current (mA)

200@Flow-Through|215@Pipelined

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

NRND

Number of Ports

A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

4

Architecture

Flow-Through|Pipelined