Freescale Semiconductor, Inc. (NXP Semiconductors) MR2A16AYS35R

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Chip Density (bit)

4M

Density Range (bit)

256K to 8M

Data Bus Width (bit)

16

Max. Access Time (ns)

35

Process Technology

0.18um

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

155

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Mounting

Surface Mount

Package Height

1.05(Max)

Package Width

10.29(Max)

Package Length

18.54(Max)

PCB changed

44

Standard Package Name

SOP

Supplier Package

TSOP-II

Lead Shape

Gull-wing

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

44

Organization

256Kx16