Freescale Semiconductor, Inc. (NXP Semiconductors) PESD12VV1BL,315

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8541.10.00.50

SVHC

Yes

Automotive

Yes

PPAP

Unknown

Direction Type

Bi-Directional

Number of Elements per Chip

1

Maximum Working Voltage (V)

12

Maximum Clamping Voltage (V)

38

Maximum Leakage Current (uA)

0.01

Peak Pulse Power Dissipation (W)

290

Capacitance Value (pF)

25

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Supplier Temperature Grade

Automotive

Mounting

Surface Mount

Package Height

0.47(Max)

Package Width

0.62(Max)

Package Length

1.02(Max)

PCB changed

2

Supplier Package

DFN

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

TVS

Pin Count

a count of all of the component leads (or pins)

2

Configuration

Single