PESD24VS1UB,115

Freescale Semiconductor, Inc. (NXP Semiconductors) PESD24VS1UB,115

Part No:

PESD24VS1UB,115

Datasheet:

-

Package:

-

AINNX NO:

31953780-PESD24VS1UB,115

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • HTS
    8541.10.00.50
  • SVHC
    Yes
  • Automotive
    Yes
  • PPAP
    Unknown
  • Direction Type
    Uni-Directional
  • Number of Elements per Chip
    1
  • Maximum Working Voltage (V)
    24
  • Minimum Breakdown Voltage (V)
    26.5
  • Maximum Breakdown Voltage (V)
    27.5
  • Maximum Clamping Voltage (V)
    70
  • Maximum Peak Pulse Current (A)
    3
  • Maximum Leakage Current (uA)
    0.05
  • Test Current (mA)
    5
  • Peak Pulse Power Dissipation (W)
    160
  • Capacitance Value (pF)
    50
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    150
  • Supplier Temperature Grade
    Automotive
  • Mounting
    Surface Mount
  • Package Height
    0.65(Max)
  • Package Width
    0.85(Max)
  • Package Length
    1.25(Max)
  • PCB changed
    2
  • Standard Package Name
    SC
  • Supplier Package
    SC-79
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    TVS
  • Pin Count

    a count of all of the component leads (or pins)

    2
  • Configuration
    Single
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