MB85R256FPNF-G-JNE2

Fujitsu Electronics America, Inc. MB85R256FPNF-G-JNE2

Part No:

MB85R256FPNF-G-JNE2

Datasheet:

-

Package:

-

AINNX NO:

31954272-MB85R256FPNF-G-JNE2

Description:

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    28
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Automotive
    No
  • PPAP
    No
  • Chip Density (bit)
    256K
  • Density Range (bit)
    256K to 8M
  • Data Bus Width (bit)
    8
  • Max. Access Time (ns)
    70
  • Process Technology
    CMOS
  • Interface Type
    Parallel
  • Minimum Operating Supply Voltage (V)
    2.7
  • Typical Operating Supply Voltage (V)
    3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Operating Current (mA)
    10
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Mounting
    Surface Mount
  • Package Height
    2.45
  • Package Width
    7.6
  • Package Length
    17.75
  • PCB changed
    28
  • Standard Package Name
    SOP
  • Supplier Package
    SOP
  • Lead Shape
    Gull-wing
  • MSL
    MSL 3 - 168 hours
  • Memory Types
    FRAM
  • Package Description
    SOP, SOP28,.45
  • Package Style
    SMALL OUTLINE
  • Number of Words Code
    32000
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    SOP28,.45
  • Operating Temperature-Min
    -40 °C
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Access Time-Max
    70 ns
  • Operating Temperature-Max
    85 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    MB85R256FPNF-G-JNE2
  • Number of Words
    32768 words
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Manufacturer
    FUJITSU Limited
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    FUJITSU LTD
  • Risk Rank
    5.55
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.71
  • Subcategory
    SRAMs
  • Technology
    CMOS
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27 mm
  • Reach Compliance Code
    compliant
  • Pin Count

    a count of all of the component leads (or pins)

    28
  • JESD-30 Code
    R-PDSO-G28
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    3.3 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    256Kbit
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ASYNCHRONOUS
  • Supply Current-Max
    0.01 mA
  • Access Time
    70ns
  • Organization
    32Kx8
  • Seated Height-Max
    2.8 mm
  • Memory Width
    8
  • Standby Current-Max
    0.00005 A
  • Memory Density
    262144 bit
  • Memory IC Type
    MEMORY CIRCUIT
  • Mixed Memory Type
    N/A
  • Width
    8.6 mm
  • Length
    17.75 mm
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