Fujitsu Electronics America, Inc. MB85RS256TYPNF-G-BCE1

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

8

ECCN (US)

EAR99

Automotive

Unknown

PPAP

Unknown

Chip Density (bit)

256K

Density Range (bit)

256K to 8M

Data Bus Width (bit)

8

Max. Access Time (ns)

13

Process Technology

CMOS

Interface Type

Serial-SPI

Minimum Operating Supply Voltage (V)

1.8

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

2.3

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

125

Mounting

Surface Mount

Package Height

1.5

Package Width

4.33(Max)

Package Length

5.3(Max)

PCB changed

8

Supplier Package

SOP

Package Description

SOP-8

Package Style

SMALL OUTLINE

Number of Words Code

32000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

125 °C

Rohs Code

Yes

Manufacturer Part Number

MB85RS256TYPNF-G-BCE1

Number of Words

32768 words

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

SOP

Package Shape

RECTANGULAR

Manufacturer

FUJITSU Limited

Part Life Cycle Code

Active

Ihs Manufacturer

FUJITSU LTD

Risk Rank

5.56

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Technology

CMOS

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

1.27 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

8

JESD-30 Code

R-PDSO-G8

Supply Voltage-Max (Vsup)

3.6 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

AUTOMOTIVE

Supply Voltage-Min (Vsup)

1.8 V

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

SYNCHRONOUS

Organization

32Kx8

Seated Height-Max

1.73 mm

Memory Width

8

Memory Density

262144 bit

Memory IC Type

MEMORY CIRCUIT

Width

3.9 mm

Length

4.89 mm