9078
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33279208-9078
Heyco Black Snap Rivet for 0.201 and panel thickness range of (0.22 - 0.26) with Head Dia. of 0.35 { PR 201-217 }
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
a group of products which fulfill a similar need for a market segment or market as a whole.
The difference between the maximum and minimum temperatures or between the highest and lowest mean temperatures during a specified time interval.
The outer diameter (OD) of a hollow circular pipe is the measurement of the outside edges of the pipe passing through its center.
a particular group of related products.