Mounting Type
Surface Mount
Package / Case
TO-236-3, SC-59, SOT-23-3
Supplier Device Package
SOT-23-3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current-Collector (Ic) (Max)
500mA
Other Names
BCR 555 E6327 BCR 555 E6327-ND BCR 555 E6327TR-ND BCR555E6327 BCR555E6327BTSA1 BCR555E6327HTSA1TR BCR555E6327XT SP000010855
Series
-
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR)
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Base Part Number
BCR555
Power - Max
330mW
Transistor Type
PNP - Pre-Biased
DC Current Gain (hFE) (Min) @ Ic, Vce
70 @ 50mA, 5V
Current - Collector Cutoff (Max)
100nA (ICBO)
Vce Saturation (Max) @ Ib, Ic
300mV @ 2.5mA, 50mA
Voltage - Collector Emitter Breakdown (Max)
50V
Frequency - Transition
150MHz
Resistor - Base (R1)
2.2 kOhms
Resistor - Emitter Base (R2)
10 kOhms