XMC1100Q024F0032ABXUMA1

International Rectifier XMC1100Q024F0032ABXUMA1

Part No:

XMC1100Q024F0032ABXUMA1

Datasheet:

-

Package:

0805 (2012 Metric)

AINNX NO:

40846612-XMC1100Q024F0032ABXUMA1

Description:

Products specifications
  • Mounting Type
    Surface Mount, MLCC
  • Package / Case
    0805 (2012 Metric)
  • Supplier Device Package
    PG-TSSOP-16-8
  • Package
    Tape & Reel (TR)
  • Base Product Number
    CDR31
  • Mfr
    Vishay Vitramon
  • Product Status
    Active
  • Voltage Rated

    RATED voltage is the voltage on the nameplate - the "design point" for maximum power throughput and safe thermal operation.

    100V
  • Number of I/Os
    18
  • Lead Free Status / RoHS Status
    Lead free / RoHS Compliant
  • Other Names
    SP001344588
  • Data Converters
    A/D 8x12b
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C ~ 125°C
  • Series
    Military, MIL-PRF-55681, CDR31
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Size / Dimension
    0.079 L x 0.049 W (2.00mm x 1.25mm)
  • Tolerance
    ±1%
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Temperature Coefficient

    The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

    BP
  • Applications
    High Reliability
  • Capacitance
    100 pF
  • Failure Rate

    the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

    M (1%)
  • Lead Spacing

    the distance between two baselines of lines of type. The word 'leading' originates from the strips of lead hand-typesetters used to use to space out lines of text evenly. The word leading has stuck, but essentially it's a typographer's term for line spacing.

    -
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • Speed
    32MHz
  • RAM Size
    16K x 8
  • Lead Style
    -
  • Voltage - Supply (Vcc/Vdd)
    1.8 V ~ 5.5 V
  • Core Processor
    ARM® Cortex®-M0
  • Peripherals
    Brown-out Detect/Reset, I²S, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    32-Bit
  • Program Memory Size
    32KB (32K x 8)
  • Connectivity
    I²C, LINbus, SPI, UART/USART
  • EEPROM Size
    -
  • Features
    -
  • Height Seated (Max)
    -
  • Thickness (Max)
    0.051 (1.30mm)
  • Ratings
    -
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