International Rectifier XMC4300F100K256AAXUMA1

Material

Polyolefin (PO)

Package

Bulk

Base Product Number

019267

Mfr

Molex

Inner Diameter - Supplied

0.125 (3.18mm)

Product Status

Active

Inner Diameter - Recovered

0.062 (1.57mm)

Number of I/Os

75

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

SP001706432 XMC4300F100K256AAXUMA1-ND XMC4300F100K256AAXUMA1TR

Data Converters

A/D 14x12b, D/A 2x12b

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C ~ 135°C

Series

Perma-Fit 19267

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Type

Tubing, Flexible

Color

Clear

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

External

Speed

144MHz

RAM Size

128K x 8

Voltage - Supply (Vcc/Vdd)

3.13 V ~ 3.63 V

Core Processor

ARM® Cortex®-M4

Peripherals

DMA, I²S, LED, POR, Touch-Sense, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

32-Bit

Program Memory Size

256KB (256K x 8)

Connectivity

CANbus, Ethernet, I²C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC

Shelf Life

-

Storage/Refrigeration Temperature

-

Shelf Life Start

-

EEPROM Size

-

Shrinkage Ratio

2 to 1

Shrink Temperature

Common polyolefin materials have a recommended shrink temperature of around 9°C, although other materials offer shrink temperatures, notably Teflon, as high as 25°C.

90°C

Features

-

Length

-

Recovered Wall Thickness

0.020 (0.51mm)