Kester Solder 24-7068-6403

Factory Lead Time

5 Weeks

Package / Case

331

Weight

1lb 453.59g

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Spool

Series

331

Published

2005

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Type

Wire Solder

Composition

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

20 AWG, 22 SWG

Wire/Cable Gauge

20 AWG

Storage/Refrigeration Temperature

50°F~104°F 10°C~40°C

Form

Spool, 1 lb (454 g)

Process

Lead Free

Melting Point

423°F~424°F 217°C~218°C

Flux Type

Water Soluble

Diameter

0.031 0.79mm

REACH SVHC

Unknown

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free