Micro-Measurements (Division of Vishay Precision Group) MMF006630

Factory Lead Time

8 Weeks

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Jar

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Solder Paste

Composition

Ag40Cu30Zn28Ni2 (40/30/28/2)

Shelf Life

9 Months

Storage/Refrigeration Temperature

41°F~77°F 5°C~25°C

Shelf Life Start

Date of Manufacture

Form

Jar, 1 oz (28g)

Process

Lead Free

Melting Point

1220°F~1435°F 660°C~780°C

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant