MMF301501

Micro-Measurements (Division of Vishay Precision Group) MMF301501

Part No:

MMF301501

Datasheet:

-

Package:

-

ROHS:

AINNX NO:

4771454-MMF301501

Category:

Solder

Description:

450-20R SOLDER TIN-ANTIMONY, 1 P

Products specifications
  • Factory Lead Time
    8 Weeks
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Spool
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Type
    Wire Solder
  • Composition
    Sn95Sb5 (95/5)
  • Wire Gauge

    a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

    24 AWG, 25 SWG
  • Form
    Spool, 1 lb (454 g)
  • Process
    Lead Free
  • Melting Point
    450°F~460°F 232°C~238°C
  • Flux Type
    Rosin Activated (RA)
  • Diameter
    0.020 0.51mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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