UPD70F3033BGF-3BA-A

NEC UPD70F3033BGF-3BA-A

Part No:

UPD70F3033BGF-3BA-A

Manufacturer:

NEC

Datasheet:

-

Package:

-

AINNX NO:

37136613-UPD70F3033BGF-3BA-A

Description:

Products specifications
  • Mounting Type
    Surface Mount
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    100
  • Mated Stacking Heights
    0.7mm
  • Package Style
    FLATPACK
  • Moisture Sensitivity Levels
    4
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    QFP100,.7X.9
  • Operating Temperature-Min
    -40 °C
  • Operating Temperature-Max
    85 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    UPD70F3033BGF-3BA-A
  • RAM(byte)
    16384
  • Package Code
    QFP
  • Package Shape
    RECTANGULAR
  • Manufacturer
    Renesas Electronics Corporation
  • ROM(word)
    65536
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    RENESAS ELECTRONICS CORP
  • Risk Rank
    5.84
  • Series
    WP7
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • JESD-609 Code
    e6
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Connector Type
    Plug, Outer Shroud Contacts
  • Number of Positions
    70
  • Terminal Finish
    Tin/Bismuth (Sn98Bi2)
  • Number of Rows
    2
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.31.00.01
  • Subcategory
    Microcontrollers
  • Pitch
    0.016 (0.40mm)
  • Technology
    CMOS
  • Terminal Position
    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Terminal Pitch

    The center distance from one pole to the next.

    0.635 mm
  • Reach Compliance Code
    unknown
  • Contact Finish
    Gold
  • JESD-30 Code
    R-PQFP-G100
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    3.3/5,5 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Speed
    20 MHz
  • Bit Size
    32
  • CPU Family
    V850
  • ROM Programmability
    FLASH
  • Features
    Solder Retention
  • Contact Finish Thickness
    3.90µin (0.099µm)
  • Height Above Board
    0.020 (0.50mm)
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