Nexperia USA Inc. BAT74,215

Factory Lead Time

4 Weeks

Mounting Type

Surface Mount

Package / Case

TO-253-4, TO-253AA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

4

Diode Element Material

SILICON

Number of Elements

2

Operating Temperature (Max.)

125°C

Power Dissipation (Max)

0.23W

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2010

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Terminal Finish

Tin (Sn)

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Base Part Number

BAT74

Pin Count

a count of all of the component leads (or pins)

4

Speed

Small Signal =< 200mA (Io), Any Speed

Diode Type

Schottky

Current - Reverse Leakage @ Vr

2μA @ 25V

Voltage - Forward (Vf) (Max) @ If

800mV @ 100mA

Forward Current

Current which flows upon application of forward voltage.

110mA

Operating Temperature - Junction

125°C Max

Output Current-Max

0.2A

Voltage - DC Reverse (Vr) (Max)

30V

Current - Average Rectified (Io)

200mA DC

Forward Voltage

the amount of voltage needed to get current to flow across a diode.

800mV

Reverse Recovery Time

5ns

Rep Pk Reverse Voltage-Max

30V

Diode Configuration

2 Independent

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant