NIC Components NSPE-HZ331M25V10X12.8NBYF

Mounting Styles

Surface Mount

Product Depth (mm)

Not Required(mm)

DCL

82.5(uA)

Operating Temperature Max Deg. C

105C

Lead Diameter (nom)

Not Required(mm)

Operating Temp Range

-55C to 105C

Lifetime

5000(hr)

Tolerance (+ or -)

20%

Seated Plane Height

Not Required(mm)

Product Diameter (mm)

10(mm)

Operating Temperature Min Deg. C

-55C

Schedule B

8532220020, 8532220020/8532220020/8532220020/8532220020/8532220020

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Type

POLYMER HYBRID

Capacitance

330UF(pF)

Construction

Cylindrical

Termination Style

Not Required

Voltage

25VDC

Ripple Current

the pulsed current consumption of non-linear devices like capacitor-input rectifiers.

4140(mA)

ESR

0.014(ohm)

Product Length (mm)

Not Required(mm)

Product Height (mm)

12.8(mm)