NIC Components NSPE-HZ560M40V8X10.8NBYF

Tolerance (+ or -)

20%

Mounting Styles

Surface Mount

Operating Temp Range

-55C to 105C

Product Depth (mm)

Not Required(mm)

Seated Plane Height

Not Required(mm)

Lead Diameter (nom)

Not Required(mm)

Operating Temperature Max Deg. C

105C

Lifetime

5000(hr)

DCL

22.4@2MIN(uA)

Product Diameter (mm)

8(mm)

Operating Temperature Min Deg. C

-55C

Schedule B

8532220020, 8532220020/8532220020/8532220020/8532220020/8532220020

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Type

POLYMER HYBRID

Capacitance

56UF(pF)

Construction

Cylindrical

Termination Style

Not Required

Voltage

40VDC

Ripple Current

the pulsed current consumption of non-linear devices like capacitor-input rectifiers.

2450(mA)

ESR

0.03(ohm)

Product Length (mm)

Not Required(mm)

Product Height (mm)

10.8(mm)