TEA6017AT/1Y

NXP TEA6017AT/1Y

Part No:

TEA6017AT/1Y

Manufacturer:

NXP

Datasheet:

-

Package:

16-SOIC (0.154, 3.90mm Width)

AINNX NO:

35657118-TEA6017AT/1Y

Description:

Power Factor Correction - PFC DCM/QR/CCM & Multi Mode PFC + Resonant power supply control IC

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    16-SOIC (0.154, 3.90mm Width)
  • Supplier Device Package
    16-SO
  • Moisture Sensitive
    Yes
  • Factory Pack QuantityFactory Pack Quantity
    2500
  • Part # Aliases
    935423847518
  • Manufacturer
    NXP
  • Brand
    NXP Semiconductors
  • RoHS
    Details
  • Package
    Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
  • Mfr
    NXP USA Inc.
  • Product Status
    Active
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cut Tape
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 150°C (TJ)
  • Series
    GreenChip™
  • Subcategory
    PMIC - Power Management ICs
  • Voltage - Supply
    19V ~ 36V
  • Frequency - Switching
    50kHz ~ 200kHz
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    PFC - Power Factor Correction
  • Mode
    Continuous Conduction (CCM), Discontinuous Conduction (DCM)
  • Current - Startup
    890 µA
  • Product Category

    a particular group of related products.

    Power Factor Correction - PFC
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