NXP Semiconductors 74AHC1G08GW,165

Number of Output Enables per Element

0

Number of Element Inputs

2-IN

Number of Elements per Chip

1

Logic Family

AHC

ECCN (US)

EAR99

Package Width

1.35(Max)

Package Length

2.25(Max)

Package Height

1(Max)

Mounting

Surface Mount

Supplier Package

TSSOP

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-40

Propagation Delay Test Condition (pF)

50

Maximum Quiescent Current (uA)

1

Maximum Operating Supply Voltage (V)

5.5

Typical Operating Supply Voltage (V)

5

Minimum Operating Supply Voltage (V)

2

Maximum High Level Output Current (mA)

-8

Maximum Low Level Output Current (mA)

8

Process Technology

CMOS

Absolute Propagation Delay Time (ns)

16

Maximum Propagation Delay Time @ Maximum CL (ns)

7.9@5V|[email protected]

Number of Element Outputs

1

Number of Selection Inputs per Element

0

PCB changed

5

Package

Bulk

Base Product Number

74AHC1G08

Mfr

NXP USA Inc.

Product Status

Active

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Series

*

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

5

Logic Function

AND

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant