NXP Semiconductors N74F38D,623

ECCN (US)

EAR99

HTS

8542.31.00.01

Logic Family

F

Number of Elements per Chip

4

Number of Element Inputs

2-IN

Number of Output Enables per Element

0

Number of Selection Inputs per Element

0

Number of Element Outputs

1

Maximum Propagation Delay Time @ Maximum CL (ns)

12.5@5V

Absolute Propagation Delay Time (ns)

13

Process Technology

Bipolar

Maximum Low Level Output Current (mA)

64

Maximum High Level Output Current (mA)

-0.25

Minimum Operating Supply Voltage (V)

4.5

Typical Operating Supply Voltage (V)

5

Maximum Operating Supply Voltage (V)

5.5

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Standard Package Name

SOP

Supplier Package

SO

Mounting

Surface Mount

Package Height

1.45(Max)

Package Length

8.75(Max)

Package Width

4(Max)

PCB changed

14

Lead Shape

Gull-wing

Package

Bulk

Base Product Number

N74F3

Mfr

NXP USA Inc.

Product Status

Active

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Series

*

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

14

Output Type

Open Collector

Logic Function

NAND

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Supplier Unconfirmed