NXP Semiconductors PCD3327CP

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

18

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

DIP,

Operating Temperature-Max

70 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom

3 V

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

SELECTABLE MAKE/BREAK RATIO 1:2

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.39.00.01

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

2.54 mm

Reach Compliance Code

unknown

JESD-30 Code

R-PDIP-T18

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Supply Current-Max

0.4 mA

Seated Height-Max

4.7 mm

Telecom IC Type

TELEPHONE DIALER CIRCUIT

Make-break Ratio

1:1.5

Length

21.6 mm

Width

7.62 mm