NXP USA Inc. BAS316/ZLF

Mounting Type

Surface Mount

Package / Case

SC-76, SOD-323

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

500nA @ 80V

Voltage - Forward (Vf) (Max) @ If

1.25V @ 150mA

Operating Temperature - Junction

150°C Max

Voltage - DC Reverse (Vr) (Max)

100V

Current - Average Rectified (Io)

215mA DC

Reverse Recovery Time

4ns

Capacitance @ Vr, F

1.5pF @ 0V 1MHz

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant