ON Semiconductor MMBFJ309LT1G

Lifecycle Status

ACTIVE (Last Updated: 1 day ago)

Factory Lead Time

8 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Package / Case

TO-236-3, SC-59, SOT-23-3

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

3

Weight

1.437803g

Breakdown Voltage / V

-25V

Number of Elements

1

Usage Level

Military grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2006

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150°C

Min Operating Temperature

-55°C

Voltage - Rated DC

-25V

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

30mA

Time@Peak Reflow Temperature-Max (s)

40

Base Part Number

MMBFJ309

Pin Count

a count of all of the component leads (or pins)

3

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

DEPLETION MODE

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

225mW

Transistor Application

AMPLIFIER

Halogen Free

Halogen Free

Drain to Source Voltage (Vdss)

25V

Transistor Type

N-Channel JFET

Continuous Drain Current (ID)

10mA

Gate to Source Voltage (Vgs)

25V

Input Capacitance

The capacitance between the input terminals of an op amp with either input grounded. It is expressed in units of farads.

5pF

FET Technology

JUNCTION

Highest Frequency Band

ULTRA HIGH FREQUENCY B

Height

1.016mm

Length

3.0226mm

Width

1.397mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free