MOCD207M

ON Semiconductor MOCD207M

Part No:

MOCD207M

Manufacturer:

ON Semiconductor

Datasheet:

MOCD2xxM

Package:

8-SOIC (0.154, 3.90mm Width)

ROHS:

AINNX NO:

4826537-MOCD207M

Description:

OPTOISO 2.5KV 2CH TRANS 8SOIC

Products specifications
  • Factory Lead Time
    6 Weeks
  • Lifecycle Status
    ACTIVE (Last Updated: 6 days ago)
  • Package / Case
    8-SOIC (0.154, 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Mount
    Surface Mount
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Number of Pins
    8
  • Weight
    251.998911mg
  • Turn Off Delay Time

    It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

    5.7 μs
  • Number of Elements
    2
  • Current Transfer Ratio-Min
    100% @ 10mA
  • Collector-Emitter Breakdown Voltage
    100V
  • Published
    2004
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~100°C
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • ECCN Code
    EAR99
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    250mW
  • Approval Agency
    UL
  • Voltage - Isolation
    2500Vrms
  • Output Voltage
    70V
  • Output Type
    Transistor
  • Voltage
    6V
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    240mW
  • Voltage - Forward (Vf) (Typ)
    1.25V
  • Input Type
    DC
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    7.5 μs
  • Forward Current

    Current which flows upon application of forward voltage.

    60mA
  • Max Output Voltage

    The maximum output voltage refers to the dynamic area beyond which the output is saturated in the positive or negative direction, and is limited according to the load resistance value.

    70V
  • Output Current per Channel
    150mA
  • Rise Time

    In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

    3μs
  • Collector Emitter Voltage (VCEO)
    70V
  • Max Collector Current
    150mA
  • Rise / Fall Time (Typ)
    3.2μs 4.7μs
  • Reverse Breakdown Voltage
    6V
  • Max Input Current
    60mA
  • Input Current
    30mA
  • Current Transfer Ratio (Max)
    200% @ 10mA
  • Turn On / Turn Off Time (Typ)
    7.5μs, 5.7μs
  • Max Junction Temperature (Tj)
    125°C
  • Reverse Voltage (DC)
    6V
  • Ambient Temperature Range High

    This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.

    100°C
  • Dark Current-Max
    50nA
  • Test Voltage
    3kV
  • Width
    4.16mm
  • Length
    5.13mm
  • Height
    3.63mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • REACH SVHC
    No SVHC
  • Lead Free
    Lead Free
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