NCN6001DTBR2G

ON Semiconductor NCN6001DTBR2G

Part No:

NCN6001DTBR2G

Manufacturer:

ON Semiconductor

Datasheet:

NCN6001

Package:

20-TSSOP (0.173, 4.40mm Width)

ROHS:

AINNX NO:

4362575-NCN6001DTBR2G

Description:

ON SEMICONDUCTOR NCN6001DTBR2G. SMART CARD INTERFACE, 5.5V, TSSOP-20

Products specifications
  • Lifecycle Status
    ACTIVE (Last Updated: 23 hours ago)
  • Factory Lead Time
    7 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Gold
  • Mounting Type
    Surface Mount
  • Package / Case
    20-TSSOP (0.173, 4.40mm Width)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    20
  • Weight
    190.990737mg
  • Published
    2006
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • JESD-609 Code
    e4
  • Pbfree Code
    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    20
  • ECCN Code
    EAR99
  • Type
    Integrated Circuit (IC)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85°C
  • Min Operating Temperature
    -25°C
  • Applications
    Smart Card
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    320mW
  • Voltage - Supply
    2.75V~5.5V
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.65mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • Base Part Number
    NCN6001
  • Pin Count

    a count of all of the component leads (or pins)

    20
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    OTHER
  • Interface
    Microcontroller
  • Operating Supply Current
    35μA
  • Halogen Free
    Halogen Free
  • Width
    4.5mm
  • Height
    1.05mm
  • Length
    6.6mm
  • REACH SVHC
    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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