NCN8026AMNTXG
24-VFQFN Exposed Pad
4360206-NCN8026AMNTXG
Compact Low Power Smart Card Interface IC SMD 24-Pin QFN T/R
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
The center distance from one pole to the next.
a count of all of the component leads (or pins)
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.