Power Integrations FF450R17ME3

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

11

Transistor Element Material

SILICON

Package Description

FLANGE MOUNT, R-XUFM-X11

Package Style

FLANGE MOUNT

Package Body Material

UNSPECIFIED

Turn-on Time-Nom (ton)

400 ns

Turn-off Time-Nom (toff)

1300 ns

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

150 °C

Rohs Code

Yes

Manufacturer Part Number

FF450R17ME3

Package Shape

RECTANGULAR

Manufacturer

Infineon Technologies AG

Number of Elements

1

Part Life Cycle Code

Not Recommended

Ihs Manufacturer

INFINEON TECHNOLOGIES AG

Risk Rank

5.55

Part Package Code

MODULE

Pbfree Code

Yes

ECCN Code

EAR99

Subcategory

Insulated Gate BIP Transistors

Terminal Position

UPPER

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

UNSPECIFIED

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

11

JESD-30 Code

R-XUFM-X11

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

Polarity/Channel Type

N-CHANNEL

Power Dissipation-Max (Abs)

2250 W

Collector Current-Max (IC)

605 A

Collector-Emitter Voltage-Max

1700 V

Gate-Emitter Voltage-Max

20 V

VCEsat-Max

2.45 V