Power Integrations FF800R17KP4_B2

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

10

Transistor Element Material

SILICON

Package Description

MODULE-10

Package Style

FLANGE MOUNT

Moisture Sensitivity Levels

1

Package Body Material

UNSPECIFIED

Turn-on Time-Nom (ton)

790 ns

Turn-off Time-Nom (toff)

1650 ns

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

175 °C

Rohs Code

No

Manufacturer Part Number

FF800R17KP4_B2

Package Shape

RECTANGULAR

Manufacturer

Infineon Technologies AG

Number of Elements

2

Part Life Cycle Code

Active

Ihs Manufacturer

INFINEON TECHNOLOGIES AG

Risk Rank

1.37

Part Package Code

MODULE

Pbfree Code

No

ECCN Code

EAR99

Subcategory

Insulated Gate BIP Transistors

Terminal Position

UPPER

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

UNSPECIFIED

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

10

JESD-30 Code

R-XUFM-X10

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SEPARATE, 2 ELEMENTS

Case Connection

ISOLATED

Transistor Application

POWER CONTROL

Polarity/Channel Type

N-CHANNEL

Power Dissipation-Max (Abs)

4850 W

Collector Current-Max (IC)

1200 A

Collector-Emitter Voltage-Max

1700 V

Gate-Emitter Voltage-Max

20 V

VCEsat-Max

2.2 V