DALC112S1

PROTEK DEVICES DALC112S1

Part No:

DALC112S1

Manufacturer:

PROTEK DEVICES

Datasheet:

-

Package:

-

AINNX NO:

31953762-DALC112S1

Description:

Products specifications
  • EU RoHS
    Not Compliant
  • ECCN (US)
    EAR99
  • HTS
    8536.30.80.00
  • Automotive
    Unknown
  • Direction Type
    Uni-Directional
  • Number of Elements per Chip
    6
  • Maximum Working Voltage (V)
    20
  • Maximum Leakage Current (uA)
    0.02
  • Maximum Power Dissipation (mW)
    145
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    150
  • Mounting
    Surface Mount
  • Package Height
    1.5(Max)
  • Package Width
    4(Max)
  • Package Length
    5(Max)
  • PCB changed
    8
  • Standard Package Name
    SOP
  • Supplier Package
    SO
  • Lead Shape
    Gull-wing
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Unconfirmed
  • Type
    Diode Array
  • Pin Count

    a count of all of the component leads (or pins)

    8
  • Configuration
    Hex
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