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Qualcomm B39272B1261P810
Part No:
B39272B1261P810
Manufacturer:
Datasheet:
Package:
-
AINNX NO:
34459749-B39272B1261P810
Category:
Description:
Qualcomm CSSP3 DPLX GT
Products specifications
- Factory Pack QuantityFactory Pack Quantity5000
- ManufacturerQualcomm RF360
- BrandRF360
- RoHSDetails
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Reel - Product Category
a particular group of related products.
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